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File:Bga und via IMGP4531 wp.jpg

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Deutsch: Schnitt durch ein SDRAM-Modul/-Riegel. Es handelt sich um eine Multilayer-Platine mit aufgelötetem IC in BGA-Technik. Rechts eine Durchkontaktierung (Via). Aufnahme mit Pentax *ist Ds, daran adaptiert ein Minolta Rokkor MC 1.8/35mm HH in Retrostellung an einem Novoflex-Balgengerät. Blende 11, 1/160s, Beleuchtung mit Mecablitz 45CT1 und externem Sensor Mecamat 45-20.
English: Cut through an SDRAM-Module. It is a multi-layer Printed Circuit Board (PCB) with BGA-packaging. On the right side a via.
Français : Coupe d'un circuit imprimé (Mémoire SDRAM) à 4 couches avec un composant de type BGA. A droite est situé un trou traversant métallisé.
Polski: Przekrój przez moduł pamięci SDRAM. Jest to wielowarstwowy obwód drukowany z przylutowanym układem scalonym w obudowie BGA. Po prawej stronie widoczna jest przelotka.
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Source Own work
Author Smial

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Image: Rainer Knäpper, Free Art License

Flexible licenses: Feel free to choose one of the free licenses stated below. Usage is free of charge, but this image is not in the public domain. If you would like special permission to use, or license this image please contact me to negotiate terms.

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Photo: Rainer Knäpper, Free Art License (http://artlibre.org/licence/lal/en/), https://commons.wikimedia.org/wiki/File:Bga_und_via_IMGP4531_wp.jpg

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Licence Art Libre Copyleft: This work of art is free; you can redistribute it and/or modify it according to terms of the Free Art License. You will find a specimen of this license on the Copyleft Attitude site as well as on other sites.
GNU head Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 only as published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts. A copy of the license is included in the section entitled GNU Free Documentation License. 1.2 only


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current20:33, 16 April 2008Thumbnail for version as of 20:33, 16 April 20082,000 × 1,232 (1.16 MB)Smial (talk | contribs){{Information |Description={{de|Schnitt durch eine Multilayer-Platine mit aufgelötetem IC in BGA-Technik. Rechts eine Durchkontaktierung (Via)}} |Source=eigene Arbeit |Date=2008-04-16 |Author= Smial |Permission= |other_versions= }} {{GFDL-

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